Switching to US chiplets, ‘manufactured in the US’, Samsung’s ‘backward’ semiconductor exports plummeted by 30%
The United States invested $5.2 billion under the Defense Products Act, and the construction of existing DRAM semiconductor chips and other chiplet substrate manufacturing 'factories in the United States' was concentrated. As it became a competitive rear, Korean semiconductor exports plummeted by 30%.
On March 27, President Biden announced the invocation of the Defense Materials Production Act to expand the US production capacity of circuit boards (PCBs) and next-generation packaging-related products.
At the time of the announcement of the US Defense Materials Production Act, it was reported that it was applied to the defense and medical fields, but in reality, the US strategy to strengthen advanced chip manufacturing is “the chiplet strategy based on advanced packaging technology is converted into an essential tool for the development of semiconductors, artificial intelligence, "The $5.2 billion subsidy package CHIPS Act aims to capture more of the processes essential to running state-of-the-art packaging plants in the United States," the NYT reported.
Of the $5.2 billion U.S. input, $3.9 billion will be used to build new and expanded manufacturing facilities, and an additional $1.1 billion will be distributed through the end of this year to support new chip technology research, with four leading semiconductor producers competing, including Samsung Texas. Attention focused investment seems highly likely to be eliminated.
Chip manufacturers Taiwan TSMC (Arizona) Samsung (Texas) Micron (New York) Intel (Ohio) of four competitions across the United States, the US Commerce Department said, "at least two are selected," the NYT said.
The NYT said that this is one of the biggest changes in chip board manufacturing in several years under the Biden administration. Instead of designing one large microprocessor with a vast number of tiny transistors, Devices' engineers developed the concept of a "chiplet," a single tiny chip that is tightly packaged to act like an electronic brain, and products from AMD, Apple, Amazon, Tesla, IBM and Intel. “We gained traction with the launch of .
The NYT continued, "Taiwan's TSMC, one of the companies leading the chiplet boom, is already making chips for AMD and hundreds of other companies and offers advanced silicon-based substrates called interposers." We have improved our existing low-cost plastic substrates with the same approach as our start-up Eliyan, and we are also developing new packaging prototypes under the Pentagon program, hoping to support the chip method for a new pilot packaging plant.”
Regarding chiplets, “Companies today typically design all chiplets in a package themselves, with their own interconnection technology. Industry groups are working on technology standards to make it easier for companies to assemble products with chiplets from other manufacturers.” The NYT said.
Regarding the new technology, the NYT said it is "currently used mainly for extreme performance." , and AMD has unveiled plans for a unique product, the MI146, which combines a large pool of memory chips with chiplets for standard computation and other chiplets designed for computer graphics.”
Regarding the reason why the key US industrial policy was decided to land on the chiplet, the NYT said, “The packaging, like making the chip itself, is overwhelmingly dominated by Asian companies.” It accounts for about 12%, but US companies provide only 3% of chip packaging.”
Regarding the trend of chiplet style design transition, market research firm Yole Group announced that 80% of microprocessors will use chiplet style design by 2027, and Synopsys has secured more than 140 customer projects based on simultaneous keying of multiple chips, NYT said. .
U.S. President Joe Biden said that advanced packaging and domestic circuit board production are essential to national security, and the Defense Production Act for U.S. and Canadian companies in the field to expand U.S. production capacity for printed circuit boards (PCBs) and next-generation packaging-related products. announced on March 27 that it would inject $5.2 billion in funding.
In response to Commerce Secretary Raymond's announcement of the most advanced logic chip production, a US Commerce Department official said "at least two," in "Building a complex supply chain to support and support facilities for different types of chips from US manufacturing clusters," he said. It should be rejected and the application reviewed,” he told the NYT.
Chipmakers have already announced plans to invest billions of dollars in new investments across the United States, with TSMC, the producer of most of the world's advanced chips, focusing on expansion in Arizona, No. 2 Samsung investing in Texas, and Micron, which makes advanced memory chips. The American technology giant Intel, which announced a large-scale expansion plan in New York and led a huge investment in securing technological superiority, started construction on 'Megasite' in Ohio, and two out of four will be selected for support by the US government.
Commerce Secretary Raymond said Samsung's investment in the US is an "expansion of its manufacturing facilities in the US", saying the vision is to restore the US to a leadership position in semiconductor technology to the point that every major global chip company wants to have both research and manufacturing facilities in the US. It seems to be used for
Research institutes in the United States previously revealed that “the US market share increased to 14%” (currently 3%) in a preliminary investigation of the’5 billion dollar investment’ invested by the chip method in 2020.
A chiplet (semiconductor piece) combines heterogeneous chips, and is pushed into a small component unit or IP (Intellectual Property) block unit constituting a processor, and connects multiple chiplets with different functions to create a process, which is an existing monolithic chip. has begun to overcome its performance limitations, high cost and excessive microprocessing.
The semiconductor division of Samsung Electronics, which persisted in increasing production despite the continued price decline of international memory semiconductors, lost 5.58 trillion won in the first quarter, and SK Hynix also suffered a loss of 3.402 trillion won.
South Korea's semiconductor exports fell by 29.4% from a year ago through April, and the decline in exports continued for 9 consecutive months on a monthly basis.
According to the Korea Customs Service’s “Export and Import Status from May 1 to 10,” exports were $14.485 billion, down 10.1% from a year ago.
Total exports declined for 7 consecutive months from October of last year to last month, and continued to be in the negative until the beginning of this month.